The Three IWR6843 Evaluation Modules at a Glance

All three modules use the same Texas Instruments IWR6843 60 to 64 GHz mmWave radar SoC. They differ in antenna geometry, mechanical form factor, and intended application. A quick decision tree:

  • Need wide field of view, ceiling mount, fast prototype? IWR6843.
  • Need a controllable beam pattern for a defined industrial zone? IWR6843ISK.
  • Building an occupancy product where elevation matters? IWR6843ODSEVM.

The decision changes the antenna and the mechanical envelope. It does not change the software stack: the mmWave SDK, Code Composer Studio, and UniFlash work identically across the three. A signal-processing chain developed on one EVM ports to the others with minor configuration changes.

Full Specification Comparison Table

IWR6843 IWR6843ISK IWR6843ODSEVM
SoCIWR6843AOPIWR6843IWR6843AOP
Frequency band60 to 64 GHz60 to 64 GHz60 to 64 GHz
AntennaAntenna-on-PackageEtched patch arrayAntenna-on-Package, tuned
TX / RX channels3 TX / 4 RX3 TX / 4 RX3 TX / 4 RX
Azimuth field of view120°108°120°
Elevation field of view120°44°120°
Typical mountingCeiling, overhead, doorwayWall, fixed-zone, industrialCeiling, with elevation rays
Best forPeople counting, occupancy with wide FoVIndustrial safety, zone monitoring, vehicle exteriorOccupancy detection, fall detection
On-board interfacesUSB, 60-pin HD connectorUSB, 60-pin HD, LVDS via DCA1000EVMUSB, 60-pin HD connector
Form factorCompact, 65 × 60 mm classMid-size, 102 × 67 mm classCompact, ceiling-suitable
Migration to productionDirect, IWR6843AOP packageDirect, IWR6843 package, custom antenna design neededDirect, IWR6843AOP package

Notes. Field-of-view numbers are the 6 dB beamwidth from the antenna pattern published in the relevant TI user guide. Always validate the pattern against your specific mounting before committing to a production design. For industrial applications where the radar sits behind a radome or housing, the housing material and thickness materially affect the pattern.

IWR6843 in Detail

Texas Instruments IWR6843 evaluation module, angled view, showing antenna-on-package layout.
IWR6843 evaluation module. The antenna is integrated into the chip package, eliminating external antenna design from the typical first-evaluation work. Image courtesy of Texas Instruments Incorporated.

The IWR6843 is the fastest path to a working 60 GHz radar prototype. The IWR6843AOP package has the antennas integrated, which means the EVM and the production PCB use the same antenna pattern. That is rare in radar: most platforms require a substantial antenna re-design when moving from EVM to product.

Where it wins: people counting, doorway monitoring, ceiling-mounted occupancy with a wide field of view, contactless presence detection in care rooms. The 120 by 120 degree pattern is forgiving of mounting variation.

Where it does not win: applications requiring a focused beam to ignore reflections from outside the safety zone. For a forklift presence sensor that must look forward and not sideways, the ISK is the better choice.

IWR6843ISK in Detail

Texas Instruments IWR6843ISK industrial starter kit evaluation module.
IWR6843ISK industrial starter kit. The etched patch array yields a narrower elevation beam well suited to defined industrial zones. Image courtesy of Texas Instruments Incorporated.

The IWR6843ISK uses an etched patch antenna array on the PCB itself, which gives a narrower elevation beam (around 44 degrees) than the IWR6843. That makes it the right starting point for industrial safety functions where the radar should see only a defined zone and ignore reflections from the floor or from above the target plane.

Where it wins: machine safety radar engineering, vehicle exterior monitoring, AGV obstacle detection. The mechanical form factor is also bigger and has more mounting options.

Where it does not win: any application where antenna-on-package would simplify the production PCB design. The patch antenna on the ISK does not migrate directly to a custom board: you would either need to redesign the antenna for the AOP variant or carry the patch antenna over with care.

IWR6843ODSEVM in Detail

Texas Instruments IWR6843ODSEVM evaluation module, occupancy detection variant, angled view.
IWR6843ODSEVM (TI part number IWR6843ISK-ODS). The patch antenna array is tuned for ceiling-mount installations that need both azimuth and elevation coverage for in-room occupancy work. Image courtesy of Texas Instruments Incorporated.

The IWR6843ODSEVM is the antenna-on-package variant tuned for occupancy work. Mechanically and electrically it is close to the IWR6843. The difference is in the reference firmware and the mounting orientation: it is designed to be ceiling-mounted with a defined look-down angle, and the bundled software emphasises people-tracking with elevation information.

Where it wins: smart building occupancy detection with elevation, and as the starting point for contactless fall detection development where vertical motion matters.

Where it does not win: as a generic prototype for radar exploration. The IWR6843 is usually a better first board because of better documentation and broader application coverage.

Accessories That Extend the EVMs

Two accessories show up on almost every program.

  • DCA1000EVM: streams raw ADC samples over LVDS via Ethernet. Essential when developing custom signal-processing algorithms that need to see pre-processed data. Adds about €400 to the bench cost.
  • MMWAVEICBOOST: a carrier card that turns the EVMs into TI BoosterPack-compatible boards. Useful for system-level prototypes where the radar pairs with a TI MCU or processor LaunchPad.

Both are widely available and well-documented. For an enterprise-tier program, plan to spend two to four weeks per engineer becoming familiar with the bench before serious algorithm work starts.

When to Pick Each EVM for Your Application

Pragmatic recommendations from running radar programs across the four application clusters on this site:

Selection is a one-time decision early in the program. The cost of changing it later is a PCB redesign and re-qualification, both substantial. Spending an extra week up front to validate the antenna pattern against the mounting envelope is always worth it.

From Evaluation to Production: Migrating to a Custom PCB

The EVM gets you to a working prototype. The product needs a custom PCB. The migration is a planned, well-understood engineering step.

The work breaks into four parts. Mechanical envelope and stack-up redesign for your housing. Antenna integration, which is straightforward for the AOP variants (the antenna comes with the package) and substantial for the ISK (you redesign or carry over the patch array). Power management, EMC, and certification region adaptation (FCC Part 15.255 in the US, ETSI EN 305 550 in the EU). And finally validation that the production board behaves identically to the EVM on your test suite.

For an enterprise program with safety implications, the production PCB is itself part of the FMEDA and safety lifecycle. Component selection, power island isolation, and EMC shielding all contribute to the dependent-failure analysis. Plan two to three months of focused PCB and FMEDA work between the working prototype and a production-intent board.

Common Mistakes in EVM Selection

  1. Picking the cheapest EVM first. If your application needs a narrow beam, starting on the IWR6843 and discovering at month four that the beam is too wide is more expensive than picking the ISK on day one.
  2. Skipping the antenna characterisation. Mount the radar on a representative mechanical mock-up before tuning algorithms. Mounting plates, housings, and nearby reflective surfaces all affect the pattern.
  3. Underestimating the SDK learning curve. The mmWave SDK is well-documented but assumes prior radar signal-processing knowledge. Budget three to four engineer-weeks for proficiency.
  4. Building production firmware on the EVM debug toolchain. The EVM tools are not the production tools. Switch to a version-controlled, qualified toolchain early.

Frequently Asked Questions

What is the difference between IWR6843 and IWR6843ISK?

The IWR6843 uses antenna-on-package with a 120 by 120 degree field of view, ideal for ceiling-mount applications. The IWR6843ISK uses a patch-antenna array with a narrower beam, tuned for industrial scenes with a defined target zone. Both share the same IWR6843 SoC and run the same mmWave SDK, so software developed on one ports to the other.

Which TI mmWave EVM is best for occupancy detection?

The IWR6843ODSEVM is purpose-tuned for occupancy detection with elevation. The IWR6843 is a strong alternative when ceiling mount and a wide field of view are needed without elevation. For an in-room sensor mounted above a doorway, the IWR6843 is usually sufficient and cheaper.

Can the IWR6843 be used in production?

In small volumes and pilots, yes. Most enterprise programs migrate to a custom PCB before mass production, for reasons of mechanical envelope, cost, certification region, and BOM control. The migration uses the same IWR6843AOP package, so software developed on the EVM ports cleanly.

What software do I need for the IWR6843?

Code Composer Studio for development, the mmWave SDK for the radar firmware, mmWave Studio for low-level data capture and debugging, and UniFlash for programming. All are free downloads from Texas Instruments. Most production projects also use a third-party DSP library and custom signal-processing code on top.

How do I migrate from the IWR6843 to a custom PCB?

Three steps. First, qualify the algorithm and antenna pattern on the EVM. Second, design a custom PCB with the same IWR6843AOP package, your specific mechanical envelope, and any region-specific power and antenna modifications. Third, port the firmware (essentially unchanged) and re-run validation against your safety and EMC requirements.

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